ROPALD is a joint TAU-VTT Proof-of-Concept research project funded by Research Council of Finland that develops new manufacturing approaches for large-area electronics based on high-resolution printing and low-temperature laser-assisted atomic layer deposition (ALD).
The project addresses key challenges in current electronics production, including environmental impact, resource consumption, and limitations in scalable fabrication technologies. In particular, it responds to the need for more sustainable alternatives to conventional silicon-based systems.
By combining VTT’s high-resolution reverse-offset printing with TAU’s laser-assisted ALD, ROPALD explores new ways to fabricate thin-film electronic devices with improved precision while maintaining low processing temperatures.