Background
The increasing global generation of electronic waste, together with the growing use of IoT devices and RFID technologies, raises significant environmental challenges. Current manufacturing approaches rely heavily on silicon-based integrated circuits, which require complex, energy-intensive processes and depend on global supply chains.
Printed electronics offer an alternative, but existing methods are limited by low resolution, restricted material options, and high processing temperatures.
Approach
The project builds on previous research results from SOIL-project (joint RCF-project between TAU and VTT) and combines:
- High-resolution patterning using reverse-offset printing
- Thin-film device fabrication using atomic layer deposition
- Localized, laser-assisted processes enabling lower temperatures
Together, these enable a lithography-free fabrication route for thin-film devices such as thin-film transistors, diodes, capacitors, and resistors at temperatures below 120 °C.
Objectives
The project aims to:
- Demonstrate a proof-of-concept fabrication process combining ROP and laser-assisted ALD
- Define process specifications and design rules for device fabrication
- Identify the most suitable application area in collaboration with industry partners