32nd Electronics Packaging Symposium organized by Integrated Electronics Engineering Center, Binghamton University – IEEC in US will be held virtually this year. Virtual symposium will be held with live presentations on September 8th at 10:00AM – 5:00PM (UTC -4), and September 9th at 10:00AM – 4:30PM (UTC-4). Please note that the timezone is 7 hours behind Finland.
The speakers in the symposium will be presenting in real time and you will get a chance to interact with them during the Q&A session after their talk. Two workshops will also held – Heterogeneous Integration Roadmap (HIR) Workshop and DoD Interests in Advanced Packaging and Integration Workshop. In session 6 on Thursday Sep. 9th at 13:00 (UTC-4) Prof. Matti Mäntysalo is presenting ‘Printed Comformable Electronics for Body-worn Sensors and Systems’.