2015
Vuorinen, T. et al., Inkjet-printed push-buttons for epidermal electronics, Printing Future Days 2015: 6th International Scientific Conference on Print and Media Technology. Verlag für Wissenschaft und Bildung VWB, 2015. p. 67-71.
Laurila, M.-M., Soltani, A., Mäntysalo, M., Inkjet printed single layer high-density circuitry for a MEMS device, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC). IEEE, 2015. p. 968-972. Laurila’s article webpage
Mäntysalo, M., Inkjet-printed wireless epidermal electronics, Radio Science Meeting (Joint with AP-S Symposium), 2015 USNC-URSI. 2015. p. 339-339. Mäntysalo’s article webpage
Khorramdel, B., Laurila, M.-M., Mäntysalo, M., Metallization of high density TSVs using super inkjet technology, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC). IEEE, 2015. p. 41-45. Khorramdel’s article webpage
Niittynen, J., Kankkunen, T., Mäntysalo, M., Thermal Modeling for Sintering of Inkjet-Printed metallic Structures, Printing Future Days 2015: 6th International Scientific Conference on Print and Media Technology. Verlag für Wissenschaft und Bildung VWB, 2015. p. 133-137.
Hecker, K. et al., Roadmap for organic and printed electronics, Smart Systems Integration 2015 – 9th International Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, NEMS, ICs and Electronic Components, SSI 2015. Apprimus Verlag, 2015. p. 125-126.
Arvani, M. et al., Electron and energy transfer in five different size quantum dots (QD) and phthalocyanine (Pc) hybrids, Photoinduced Hole Transfer in QD-Phthalocyanine Hybrids-MRS fall meeting. MRS fall meeting, Boston, USA, 2015.
2014
Lehtimäki, S. et al., Fabrication and characterization of solution-processed carbon nanotube supercapacitors, 2013 MRS Fall Meeting – Symposium SS/XX – Micro- and Nanoscale Systems – Novel Materials, Structures and Devices. MATERIALS RESEARCH SOCIETY, 2014. Lehtimäki’s article webpage
Heljo, P. S., Majumdar, H. S., Lupo, D., High Throughput Electrochemical Method for Contact Optimization in Printed Rectifying Diodes, 2013 MRS Fall Meeting – Symposium M – Large-Area Processing and Patterning for Active Optical and Electronic Devices. MATERIALS RESEARCH SOCIETY, 2014. Heljo’s article webpage
Janka, M. et al., Modelling of Joule heating based self-alignment method for metal grid line passivation, 2013 MRS Fall Meeting – Symposium M – Large-Area Processing and Patterning for Active Optical and Electronic Devices. MATERIALS RESEARCH SOCIETY, 2014. Janka’s article webpage
Khorramdel, B., Mäntysalo, M., Inkjet Filling of TSVs with Silver Nanoparticle Ink, 2014 Electronics System-Integration Technology Conference (ESTC), 16-18 September 2014, Helsinki, Finland. Institute of Electrical and Electronics Engineers IEEE, 2014. p. 1-5. Khorramdel’s article webpage
Soltani, A., Kumpulainen, T., Mäntysalo, M., Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 27-30 May 2014, Orlando, FL. Institute of Electrical and Electronics Engineers IEEE, 2014. p. 1685-1689. Soltani’s article webpage
Sillanpää, H. et al., Inkjet printed wireless biosensors on stretchable substrate, 2014 International Conference on Electronics Packaging (ICEP), 23-25 April 2014, Toyama, Japan. Institute of Electrical and Electronics Engineers IEEE, 2014. p. 322-325. Sillanpää’s article webpage
Liimatta, T. et al., Inkjet printing in manufacturing of stretchable interconnects, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 27-30 May 2014, Orlando, FL. Institute of Electrical and Electronics Engineers IEEE, 2014. p. 151-156. Liimatta’s article webpage
Tuukkanen, S. et al., Printable and disposable supercapacitor from nanocellulose and carbon nanotubes, ESTC 2014, 5th Electronics System-Integration Technology Conference, September 16 – 18, 2014, Helsinki, Finland. Institute of Electrical and Electronics Engineers IEEE, 2014. p. 1-6. Tuukkanen’s article webpage
Sillanpää, H. et al., Integration of inkjet and RF SoC technologies to fabricate wireless physiological monitoring system, 2014 Electronics System-Integration Technology Conference (ESTC), 16-18 September 2014, Helsinki, Finland. Institute of Electrical and Electronics Engineers IEEE, 2014. p. 1-5. Sillanpää’s article webpage
Vuorinen, T. et al., Spray coating of self-aligning passivation layer for metal grid lines, 2014 Electronics System-Integration Technology Conference (ESTC), 16-18 September 2014, Helsinki, Finland. Institute of Electrical and Electronics Engineers IEEE, 2014. p. 1-3. Vuorinen’s article webpage
Niittynen, J. et al., Reliability of Flex-to-Flex Interconnections on Inkjet-Printed PCBs Using Electrically Conductive Adhesives, SMTA Pan Pacific Microelectronics Symposium, February 11-13, 2014, Hawaii, USA. Edina, Minnesota : Surface Mount Technology Association, 2014. p. 1-8.