Surface Science Laboratory

The main research methods at the Surface Science Laboratory (SSL) at Tampere University (TAU) are photoelectron spectroscopy, photoemission electron microscopy, scanning tunneling microscopy, low energy electron diffraction, and impedance spectroscopy. The surface analysis systems are equipped with various sample preparation and surface modification facilities enabling sample treatments in UHV.

In addition to the local research infrastructure, we have competence in utilizing advanced synchroton light sources (e.g. MAX IV Laboratory) for research. Synchrotron light enables unique experiments for elucidating surface phenomena at near-ambient pressure, in ultra-fast temporal regime, or when the laboratory-based spectroscopies simply do not provide sufficient resolution or elemental specificity for meeting the scientific challenges.

Research infrastructure at TAU

UHV systems

  • Spectromicroscopy: Photoemission electron microscopy (PEEM), Small spot spectroscopy XPS/UPS, Energy-filtered imaging XPS/UPS, Chemical mapping, Momentum microscopy in k-space
  • Electron spectroscopy: X-ray photoelectron spectroscopy (XPS), Auger electron spectroscopy (AES), Ultraviolet photoelectron spectroscopy (UPS)
  • Scanning tunneling microscopy (STM)
  • Molecular beam surface scattering (MBSS)
  • Low energy electron diffraction (LEED)
  • Thermal desorption spectroscopy (TDS)

Other facilities

  • Electrochemical instruments: Potentiostat/galvanostat, Electrochemical impedance spectroscopy (EIS), Electrochemical quartz crystal microbalance (EQCM)
  • Inductively coupled plasma mass spectrometry (ICP-MS)
  • Gas chromatography (GC)
  • Photoelectrochemical flow cell
  • Solar simulator for photonics research
  • Optical contact angle meter for measurement of static contact angle, dynamic contact angles, surface free energy, surface tension, interfacial tension, batch contact angle
  • Pull-off adhesion gauge

The sample preparation and thin film deposition facilities

  • Various sample preparation and surface modification methods in UHV and in mbar regime: Sputtering, Annealing, Physical vapour deposition (PVD), Activated ion bombardment, Evaporation, Electrospraying, Oxidation, Reduction, Gas exposures, Atomic hydrogen cleaning, etching and passivation
  • Plasma surface treater
  • Atomic layer deposition (ALD)
  • Various sample preparation and surface modification methods in liquid phase: Electrochemical deposition and treatments, Liquid phase deposition of molecules